Which of the following thermal resistance parameters depends on the size of the device and the clamping pressure? - Study24x7
Social learning Network
study24x7

Default error msg

Login

New to Study24x7 ? Join Now
Already have an account? Login
20 Apr 2019 12:40 PM study24x7 study24x7

Which of the following thermal resistance parameters depends on the size of the device and the clamping pressure?

A

θsA

B

 θcs

C

θjc

D

None

study24x7
Write a comment
  • geet sharma
  •  The case-to-sink thermal resistance depends on the size of the device, pressure, grease between the interface, etc.
    Related Questions
    500+   more Questions to answer
    Most Related Articles